Ultrasonic probe, connection component for array elements and ultrasonic imaging system thereof

ABSTRACT

A connection component for array elements in an ultrasonic probe comprises a first-layer body and a second-layer body, wherein the second-layer body is connected with the first-layer body, and an area of the second-layer body is smaller than an area of the first-layer body. A region in the first-layer body that extends beyond the second-layer body is provided with at least one first-layer conductive element penetrating through the first-layer body. A lower surface of the second-layer body is provided with at least one second-layer conductive element penetrating through the second-layer body and the first-layer body. A signal transmission line is connected to the array elements by the first-layer conductive elements and the second-layer conductive elements. The connection component for array elements is in a stepped shape. The signal transmission line is connected to an array element assembly through the stepped connection component for array elements to provide sufficient space.

CROSS-REFERENCE

This application is a continuation of Patent Cooperation TreatyApplication No. PCT/CN2013/081908, filed Dec. 20, 2012, which is herebyincorporated by reference.

TECHNICAL FIELD

The present disclosure relates to ultrasonic diagnosis, and moreparticularly to ultrasonic probes.

BRIEF SUMMARY

The present disclosure relates to ultrasonic probes, in particular toultrasonic probes, and connection components for array elements andultrasonic imaging systems thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

Objects, features and advantages of the present disclosure will be moreobvious by detailed description of preferred embodiments of the presentdisclosure illustrated in drawings. In the drawings, same referencenumerals represent the same parts, with a focus on illustrating theprinciple of the present disclosure instead of proportionally scalingthe drawings deliberately based on actual sizes.

FIG. 1 is an exploded perspective view of an ultrasonic probe in oneembodiment;

FIG. 2 is a perspective view of a transducer in one embodiment;

FIG. 3 is an exploded perspective view of an array element assembly inone embodiment;

FIG. 4 is a diagram of a combination of the array element assembly inone embodiment;

FIG. 5 is a perspective view of a connection component for arrayelements in one embodiment;

FIG. 6 is another perspective view of the connection component for arrayelements shown in FIG. 5;

FIG. 7 is a cross-sectional exploded view of a connection component forarray elements in one embodiment;

FIG. 8 is a cross-sectional view of a combination of a connectioncomponent for array elements shown in FIG. 7;

FIG. 9 is a cross-sectional view of a connection component for arrayelements in another embodiment;

FIG. 10 is a perspective view of a connection component for arrayelements in another embodiment;

FIG. 11 is a cross-sectional view of a connection component for arrayelements and a signal transmission component in another embodiment;

FIG. 12 is an enlarged view of the region marked A in FIG. 11;

FIG. 13 is a diagram of connection between a signal transmission lineand a connection component for array elements in another embodiment;

FIG. 14 is a perspective view of an array element assembly and aconnection component for array elements in another embodiment; and

FIG. 15 is another perspective view of an array element assembly and aconnection component for array elements shown in FIG. 14.

DETAILED DESCRIPTION

In a medical ultrasonic imaging system, an ultrasonic probe is used foremitting ultrasonic waves and receiving echoes carrying information onhuman tissues. A common ultrasonic probe consists generally of anultrasonic head housing, a transducer, and a handle module, wherein thetransducer is a device for emitting ultrasonic waves and receivingechoes. The transducer is a core part of the ultrasonic probe, whichconsists generally of a matching layer, a wafer, a flexible printedcircuit board (FPC) and a backing block. One-dimensional (1-D)ultrasonic probes are widely used at present. With respect to a 1-Dultrasonic probe, array elements of the transducer are usually arrangedin a 1-D direction, and an electrical connection of the array elementsis drawn from both sides of the FPC.

Two-dimensional (2-D) matrix ultrasonic probes have found anincreasingly wide utilization. The difference between 1-D ultrasonicprobes and 2-D matrix ultrasonic probes is that array elements oftransducer in a 2-D matrix ultrasonic probe are arranged along twodimensions to form an array of transducer array elements, that is, thereare a total of M×N transducer array elements, wherein M is the number ofrows in the array and N is the number of columns in the array. There areusually thousands of array elements in the transducer of the 2-D matrixultrasonic probe. Therefore, making an interconnection between thetransducer elements and their corresponding controlling elements (suchas chips, high-voltage switches, etc.) in the 2-D matrix ultrasonicprobe may be a challenge. When the 2-D ultrasonic probe adopts theinterconnection manner employed by the transducer of the 1-D ultrasonicprobe, the circuits of FPCs or printed circuit boards (PCBs) may be verydense and even intricate due to numerous transducer array elements,which is beyond the manufacturing capacity of FPCs and PCBs. Someexisting interconnection methods used to connect the transducer arrayelements and their corresponding controlling elements in the 2-D matrixultrasonic probe may have a high registration requirement, a complicatedprocess, and a high cost.

It might be necessary to provide a connection component for arrayelements which can provide sufficient space for connecting signaltransmission lines to array elements, and an ultrasonic probe includingthe connection component for array elements and an ultrasonic imagingsystem thereof.

The connection component for array elements in an ultrasonic probe mayinclude a first-layer body, a second-layer body, a first-layerconductive element and a second-layer conductive element. Thefirst-layer body may have a first upper surface and a first lowersurface. The second-layer body may have a second upper surface and asecond lower surface. The second upper surface may contact with thefirst lower surface, and an area of the second upper surface may besmaller than an area of the first lower surface. A region in the firstlower surface that extends beyond the second upper surface may form afirst-layer wiring connection region. The second lower surface may thenform a second-layer wiring connection region. The first-layer conductiveelement may be arranged on the first-layer wiring connection region andmay pass through the first body and extend to the first upper surface.The second-layer conductive element may be arranged on the second-layerwiring connection region and may pass through the second-layer body andthe first-layer body, and extend to the first upper surface of thefirst-layer body.

In one embodiment, the connection component for array elements mayfurther include a third-layer body and a third-layer conductive element.The third-layer body may have a third upper surface and a third lowersurface. The third upper surface may contact with the second lowersurface. An area of the third upper surface may be smaller than an areaof the second lower surface. A region in the second lower surface thatextends beyond the third upper surface may form a second-layer wiringconnection region. The third lower surface may form a third-layer wiringconnection region thereon. The third-layer conductive element may bearranged on the third-layer wiring connection region and may passthrough the third-layer body, the second-layer body and the first-layerbody, and then extend to the first upper surface of the first-layerbody.

The ultrasonic probe may include a transducer. The transducer mayinclude an array element assembly, a connection component for arrayelements, a first-group signal transmission line and a second-groupsignal transmission line. The array element assembly may have aplurality of array elements. The connection component for array elementsmay include a first-layer body, a second-layer body, a plurality offirst-layer conductive elements and a plurality of second-layerconductive elements. The first-layer body may have a first upper surfaceand a first lower surface. A plurality of conductive contacts may bearranged on the first upper surface. Each conductive contact may beconnected to one of the array elements. The second-layer body may have asecond upper surface and a second lower surface. The second uppersurface may contact the first lower surface. An area of the second uppersurface may be smaller than an area of the first lower surface. A regionin the first lower surface that extends beyond the second upper surfacemay form a first-layer wiring connection region. A second lower surfacemay form a second-layer wiring connection region. The plurality offirst-layer conductive elements may be arranged on the first-layerwiring connection region. The plurality of first-layer conductiveelements may pass through the first-layer body and extend to the firstupper surface of the first-layer body. Each first-layer conductiveelement may be connected to one of the conductive contacts. Theplurality of second-layer conductive elements may be arranged on thesecond-layer wiring connection region. The plurality of second-layerconductive elements may pass through the second-layer body and thefirst-layer body and extend to the first upper surface of thefirst-layer body. Each second-layer conductive element may be connectedto one of the conductive contacts. The first-group signal transmissionline may be connected to the plurality of first-layer conductiveelements. The second-group signal transmission line may be connected tothe plurality of second-layer conductive elements.

In one embodiment, the first-group signal transmission line may includea first-group substrate layer and a first-group wire formed on thefirst-group substrate layer. The second-group signal transmission linemay include a second-group substrate layer and a second-group wireformed on the second-group substrate layer. The second-layer body may bean extension of the first-group substrate layer. The first-group wiremay be connected to the first-layer conductive elements. Thesecond-group wire may be connected to the second-layer conductiveelements.

In another embodiment, the connection component for array elements mayfurther include a third-layer body and a plurality of third-layerconductive elements. The third-layer body may have a third upper surfaceand a third lower surface. The third upper surface may contact thesecond lower surface. An area of the third upper surface may be smallerthan an area of the second lower surface. A region in the second lowersurface that extends beyond the third upper surface may form asecond-layer wiring connection region. The third lower surface may forma third-layer wiring connection region. The plurality of third-layerconductive elements may be arranged on the third-layer wiring connectionregion. Third-layer conductive elements may pass through the third-layerbody, the second-layer body and the first-layer body and extend to thefirst upper surface of the first-layer body. Each third-layer conductiveelement may be connected to one of the conductive contacts. Theultrasonic transducer may further include a third-group signaltransmission line connected to the plurality of third-layer conductiveelements.

In still another embodiment, the first-group signal transmission linemay include a first-group substrate layer and a first-group wire formedon the first-group substrate layer. The second-group signal transmissionline may include a second-group substrate layer and a second-group wireformed on the second-group substrate layer. The third-group signaltransmission line may include a third-group substrate layer and athird-group wire formed on the third-group substrate layer. Thesecond-layer body may be an extension of the first-group substratelayer. The third-layer body may be an extension of the second-groupsubstrate layer. The first-group wire may be connected to thefirst-layer conductive element. The second-group wire may be connectedto the second-layer conductive element. The third-group wire may beconnected to the third-layer conductive element.

In another embodiment, the first upper surface may be provided with aplurality of conductive contacts. Each conductive contact iselectrically connected to one of the array elements.

In another embodiment, each array element may include a transducerelement and a backing block connected to the transducer element.

In another embodiment, the first-layer body, the second-layer body andthe backing block may be made of same material.

The ultrasonic imaging system may include any one of the foregoingultrasonic probes.

In the foregoing embodiments, the connection component for arrayelements may be in a stepped shape. The signal transmission line may beconnected to an array element assembly through the stepped connectioncomponent; thus there might be sufficient space for an interconnectionbetween the signal transmission line and the array element assembly.

To make it easier to understand the present disclosure, all technicaland scientific terms used herein have the same meaning as commonlyunderstood by those skilled in the art to which the present disclosurebelongs. The preferred embodiments of the present disclosure are shownin the drawings. However, the present disclosure can be realized in avariety of forms, without being construed as limited to the describedembodiments herein; rather, these embodiments are provided in order tomake the present disclosure thorough and complete.

Unless otherwise defined, all technical and scientific terms used hereinhave the same meaning as commonly understood by those skilled in the artto which the present disclosure belongs. Terms used herein to describeparticular embodiments are not intended to limit the present disclosure.As used herein, the term “and/or” includes any and all combinations ofone or more of the item being described.

As shown in FIG. 1, the ultrasonic probe in an embodiment may have anultrasonic head housing 1, a transducer 2 and a handle module 3. Theultrasonic head housing 1 and the handle module 3 may form a receivingcavity when they connect to each other. The transducer 2 may be fixedlyaccommodated in the receiving cavity. In one embodiment, the positionand connection among the ultrasonic head housing 1, the transducer 2 andthe handle module 3 may be identical or similar to those in aconventional ultrasonic probe, which will not be described in detailherein.

It may be appreciated that the shape and structure of the probe shown inFIG. 1 are merely illustrated as an exemplary embodiment of theultrasonic probe of the present disclosure, and are not intended tolimit the present disclosure to the probe shown in FIG. 1. For example,the probe in FIG. 1 may be used for heart scans. The disclosures hereincan be used in many types of ultrasonic probes. FIG. 1 illustrates justone example of the probe of the present disclosure without a specificdescription of the exemplary ultrasonic probe, e.g., specifics anddetails about structure, connection, proportion of components, and soon.

In one embodiment in FIG. 2, the transducer 2 may include an arrayelement assembly 20, a connection component for array elements 21 and asignal transmission line component 22.

The array element assembly 20 may include a plurality of array elements.For example, the array element assembly 20 can be an array of M×N arrayelements, where M is the number of rows and N is the number of columnsin the array, and M and N are natural numbers greater than 0. In oneembodiment, the arrangement of array elements in the array can beconfigured freely according to the actual design of the ultrasonicprobe, for example, these array elements can be arranged as theaforesaid array of M×N in a rectangular or square shape, where M and Ncan be any natural numbers greater than 0. Alternatively, they can bearranged in a nearly circular shape, an elliptic shape, or any irregularshape. The quantity of the array elements can be set according to actualrequirements and is not limited in the present disclosure.

The array element assembly 20 may be connected to the upper surface ofthe connection component for array elements 21, and the signaltransmission line component 22 can be electrically connected to thearray elements in the array element assembly 20 through the connectioncomponent for array elements 21 (detailed description below).

In one embodiment as shown in FIG. 3 and FIG. 4, there may be a matchinglayer 25 over the array element assembly 20. The matching layer 25 maybe any common matching layer currently used in ultrasonic probes, andwill not be described in detail herein.

As shown in FIG. 3 and FIG. 4, in one embodiment, each array element inthe array element assembly 20 may include a transducer element and abacking block that is below the transducer element. The transducerelement and the backing block in each array element may be disposed in astacked arrangement and electrically connected to each other; that is,the transducer element may be connected to the element connectingcomponent 21 through the backing block in one embodiment.

In another embodiment of the present disclosure, an array element in anarray element assembly 20 may be only a transducer element; that is, thetransducer element may be directly connected to the connection componentfor array elements 21 in one embodiment. In this respect, for example,the connection component for array elements 21 and the backing block maybe made of similar backing material.

It can be understood that, since an array element assembly 20 isarranged in an array, transducer elements may be arranged to be atransducer element array 200, and backing blocks may be arranged to be abacking block array 202, which is below the transducer element array200, in one embodiment, where the array element assembly 20 may includethe transducer elements and the backing blocks, as shown in FIG. 3 andFIG. 4.

In one embodiment, the connection between transducer elements andbacking blocks can be a common conventional connection, which will notbe described in detail herein.

As previously described, a connection component for array elements 21may also be included in one embodiment. FIGS. 5-8 illustrate theconnection component for array elements 21 of one embodiment.

In one embodiment, the connection component for array elements 21 caninclude a plurality of layers of bodies; for example, it can include atleast two layers of bodies, three layers of bodies, four layers ofbodies, and so forth. For instance, the connection component for arrayelements 21 shown in FIGS. 5-8 includes five layers of bodies (i.e.,210, 211, 212, 215 and 216). One embodiment shown in FIGS. 5-8 is anexample of the connection component for array elements, and theconnection component for array elements of the present disclosure is notlimited to five bodies. In another embodiment, the number of layers inthe bodies may be configured based on an actual design, as long as theconnection component for array elements has at least two layers. Theexamples described below are shown in FIGS. 5-8, but they do not need tobe identical.

In one embodiment, the connection component for array elements 21 mayinclude a first-layer body 210, a second-layer body 211, a third-layerbody 212, a fourth-layer body 215 and a fifth-layer body 216. Each bodymay have an upper surface and a lower surface.

In one embodiment shown in FIG. 7, the first-layer body 210 may have afirst upper surface 2101 and a first lower surface 2102; thesecond-layer body 211 may have a second upper surface 2111 and a secondlower surface 2112; the third-layer body 212 may have a third uppersurface 2121 and a third lower surface 2122; the fourth-layer body 215may have a fourth upper surface 2151 and a fourth lower surface 2152;and the fifth-layer body 216 may have a fifth upper surface 2161 and afifth lower surface 2162.

The second upper surface 2111 of the second-layer body 211 may contactthe first lower surface 2102 of the first-layer body 210. An area of thesecond upper surface 2111 of the second-layer body 211 may be smallerthan an area of the first lower surface 2102 of the first-layer body210, so that at least a region of the first lower surface 2102 of thefirst-layer body 210 may extend beyond the second upper surface 2111 ofthe second-layer body 211. The region that extends beyond the secondupper surface 2111 in the first lower surface 2102 may form afirst-layer wiring connection region 2100 of the first-layer body 210(see FIG. 6 and FIG. 8).

Similarly, the third upper surface 2121 of the third-layer body 212 maycontact the second lower surface 2112 of the second-layer body 211. Anarea of the third upper surface 2121 of the third-layer body 212 may besmaller than an area of the second lower surface 2112 of thesecond-layer body 211, so that at least a region of the second lowersurface 2112 of the second-layer body 211 may extend beyond the thirdupper surface 2121 of the third-layer body 212. The region extending outof the third upper surface 2121 in the second lower surface 2112 mayform a second-layer wiring connection region 2110 of the second-layerbody 211 (see FIG. 6 and FIG. 8).

Similarly, the fourth upper surface 2151 of the fourth-layer body 215may contact the third lower surface 2122 of the third-layer body 212. Anarea of the fourth upper surface 2151 of the fourth-layer body 215 maybe smaller than an area of the third lower surface 2122 of thethird-layer body 212, so that at least a region of the third lowersurface 2122 of the third-layer body 212 may extend beyond the fourthupper surface 2151 of the fourth-layer body 215. The region extendingout of the fourth upper surface 2151 in the third lower surface 2122 mayform a third-layer wiring connection region 2120 of the third-layer body212 (see FIG. 6 and FIG. 8).

Similarly, the fifth upper surface 2161 of the fifth-layer body 216 maycontact the fourth lower surface 2152 of the fourth-layer body 215. Anarea of the fifth upper surface 2161 of the fifth-layer body 216 may besmaller than an area of the fourth lower surface 2152 of thefourth-layer body 215, so that at least a region of the fourth lowersurface 2152 of the fourth-layer body 215 may extend beyond the fifthupper surface 2161 of the fifth-layer body 216. The region extending outof the fifth upper surface 2161 in the fourth lower surface 2152 mayform a fourth-layer wiring connection region 2150 of the fourth-layerbody 215 (see FIG. 6 and FIG. 8).

In one embodiment, the entire fifth lower surface 2162 of thefifth-layer body 216 may form a fifth-layer wiring connection region2160 of the fifth-layer body 216; that is, the fifth-layer wiringconnection region 2160 of the fifth-layer body 216 is the fifth lowersurface 2162. In this respect, the entire lower surface forming thewiring connection region may be referred to as the wiring connectionregion of the corresponding body.

The first-layer wiring connection region 2100 may be provided with atleast a first-layer conductive element 2105 which may pass through thefirst-layer body 210 and extend to the first upper surface 2101 of thefirst-layer body 210.

The second-layer wiring connection region 2110 may be provided with atleast a second-layer conductive element 2115 which may pass through thesecond-layer body 211 and the first-layer body 210 and extend to thefirst upper surface 2101 of the first-layer body 210.

The third-layer wiring connection region 2120 may be provided with atleast a third-layer conductive element 2125 which may pass through thethird-layer body 212, the second-layer body 211 and the first-layer body210 and extend to the first upper surface 2101 of the first-layer body210.

The fourth-layer wiring connection region 2150 may be provided with atleast a fourth-layer conductive element 2155 which may pass through thefourth-layer body 215, the third-layer body 212, the second-layer body211 and the first-layer body 210 and extend to the first upper surface2101 of the first-layer body 210.

The fifth-layer wiring connection region 2160 (i.e., the fifth lowersurface 2162 of the fifth-layer body in one embodiment) may be providedwith at least a fifth-layer conductive element 2165 which may passthrough the fifth-layer body 216, the fourth-layer body 215, thethird-layer body 212, the second-layer body 211 and the first-layer body210 and extend to the first upper surface 2101 of the first-layer body210.

In one embodiment, the first upper surface 2101 of the first-layer body210 can be provided with a plurality of conductive contacts 2106 forelectrically connecting to the array element assembly 20. Eachconductive contact 2106 may electrically connect to one of the arrayelements in the array element assembly 20; that is, it may be directlyand electrically connected to one of the transducer elements, or it maybe indirectly and electrically connected to one of the transducerelements through the backing block of the array element (detaileddescription below).

It can be appreciated that, in one embodiment, these conductive contacts2106 may be disposed in the first upper surface 2101 of the first-layerbody 210, and may correspond to the array element assembly 20 which isconnected to the connection component for array elements 21. Forexample, each conductive contact 2106 may correspond and electricallyconnect to one array element of the array element assembly 20. In thisrespect, position, dimension, spacing and arrangement of the conductivecontacts 2106 on the first upper surface 2101 of the first-layer body210 may correspond to that of the array elements of the array elementassembly 20 according to actual requirements.

In one embodiment, the conductive contacts can be realized in any formsand/or materials as long as they can be electrically connected to thearray element of the array element assembly 20. For example, in anembodiment, the conductive contacts may be in the form of pads, but theycan be in any other suitable form in other embodiments.

As previously described, the first-layer conductive element 2105 on thefirst-layer wiring connection region 2100 may pass through thefirst-layer body 210 and extend to the first upper surface 2101 of thefirst-layer body 210. The first-layer conductive elements 2105 can, forexample, pass through the first-layer body 210 via holes formed at thefirst-layer body 210, extend to the first upper surface 2101 of thefirst-layer body 210, and electrically connect to the aforementionedplurality of conductive contacts 2106. Each first-layer conductiveelement 2105 may be connected to one of the conductive contacts 2106.

Similarly, the second-layer conductive elements 2115 on the second-layerwiring connection region 2110 can also, for example, pass through thesecond-layer body 211 and the first-layer body 210 via holes formed inthe second-layer body 211 and the first-layer body 210. They then extendto the first upper surface 2101 of the first-layer body 210, andelectrically connect to the aforementioned plurality of conductivecontacts 2106. Each second-layer conductive element 2115 may beconnected to one of the conductive contacts 2106.

Similarly, the third-layer conductive elements 2125 on the third-layerwiring connection region 2120 can also, for example, pass through thethird-layer body 212, the second-layer body 211 and the first-layer body210 via holes formed in the third-layer body 212, the second-layer body211 and the first-layer body 210. They then extend to the first uppersurface 2101 of the first-layer body 210, and electrically connect tothe aforementioned plurality of conductive contacts 2106. Eachthird-layer conductive element 2125 may be connected to one of theconductive contacts 2106.

Similarly, the fourth-layer conductive elements 2155 on the fourth-layerwiring connection region 2150 can also, for example, pass through thefourth-layer body 215, the third-layer body 212, the second-layer body211 and the first-layer body 210 via holes formed in the fourth-layerbody 215, the third-layer body 212, the second-layer body 211 and thefirst-layer body 210. They then extend to the first upper surface 2101of the first-layer body 210, and electrically connect to theaforementioned plurality of conductive contacts 2106. Each fourth-layerconductive element 2155 may be connected to one of the conductivecontacts 2106.

Similarly, the fifth-layer conductive element 2165 on the fifth-layerwiring connection region 2160 can also, for example, pass through thefifth-layer body 216, the fourth-layer body 215, the third-layer body212, the second-layer body 211 and the first-layer body 210 via holesformed in the fifth-layer body 216, the fourth-layer body 215, thethird-layer body 212, the second-layer body 211 and the first-layer body210. They then extend to the first upper surface 2101 of the first-layerbody 210, and electrically connect to the aforementioned plurality ofconductive contacts 2106. Each fifth-layer conductive element 2165 maybe connected to one of the conductive contacts 2106.

In one embodiment, the connection component for array elements mayinclude five layers of bodies; for example, the total amount of thefirst-layer conductive elements 2105, the second-layer conductiveelements 2115, the third-layer conductive elements 2125, thefourth-layer conductive elements 2155 and the fifth-layer conductiveelements 2165 may equal the amount of conductive contacts 2106 on thefirst upper surface 2101 of the first-layer body 210. That is, thefirst-layer conductive elements 2105, the second-layer conductiveelements 2115, the third-layer conductive elements 2125, thefourth-layer conductive elements 2155 and the fifth-layer conductiveelements 2165 may correspond one-to-one to conductive contacts 2106 onthe first upper surface 2101 of the first-layer body 210.

In one embodiment, each conductive contact 2106 may be part of theconductive element connected thereto, for example, the first-layerconductive elements 2105, the second-layer conductive elements 2115, thethird-layer conductive elements 2125, the fourth-layer conductiveelements 2155 or the fifth-layer conductive elements 2165, and so forth.That is, the conductive contact may be molded integrally with theconductive element connected thereto.

In one embodiment, conductive elements in each layer of a body, such asthe first-layer conductive elements 2105, and the second-layerconductive elements 2115, the third-layer conductive elements 2125, thefourth-layer conductive elements 2155 or the fifth-layer conductiveelements 2165 and so forth, can be made of any suitable conductivematerial, such as copper, silver, gold, or other metal or non-metalconductive material.

In one embodiment, the fifth-layer body 216, the fourth-layer body 215,the third-layer body 212, the second-layer body 211 and the first-layerbody 210 may be separate components and may connect together as shown inFIG. 7 and FIG. 8. In other embodiments of the present disclosure, thefifth-layer body 216, the fourth-layer body 215, the third-layer body212, the second-layer body 211 and the first-layer body 210 may also bemolded integrally as shown in FIG. 9. Herein, one layer of a bodycombining with another layer of a body also includes these two layers ofbodies being molded integrally.

In one embodiment, signal transmission components 22 may include aplurality of groups of signal transmission lines. For example, in oneembodiment shown in FIG. 2, signal transmission components 22 mayinclude a first-group signal transmission line 220, a second-groupsignal transmission line 221, a third-group signal transmission line222, a fourth-group signal transmission line 225 and a fifth-groupsignal transmission line 226.

In one embodiment, the first-group signal transmission line 220 may beconnected to the first-layer conductive element 2105 which are providedin the first-layer wiring connection region 2100 of the elementconnecting component 21; the second-group signal transmission line 221may be connected to the second-layer conductive element 2115 which areprovided in the second-layer wiring connection region 2110 of theelement connecting component 21; the third-group signal transmissionline 222 may be connected to the third-layer conductive element 2125which are provided in the third-layer wiring connection region 2120 ofthe element connecting component 21; the fourth-group signaltransmission line 225 may be connected to the fourth-layer conductiveelement 2155 which are provided in the fourth-layer wiring connectionregion 2150 of the element connecting component 21; and the fifth-groupsignal transmission line 226 may be connected to the fifth-layerconductive element 2165 which are provided on the fifth-layer wiringconnection region 2160 of the element connecting component 21. Aspreviously described, conductive elements in each wiring connectionregion of the connection component for array elements 21 may berespectively connected to each conductive contact 2106 which are on thefirst upper surface 2101 of the connection component for array elements21, and the conductive contacts 2106 may also be respectively connectedto each array element in the array element assembly 20. The electricalconnection between each group of signal transmission line and each arrayelement of the array element assembly 20 can be achieved by theconnection component for array elements 21 in this manner. The ends ofthese signal transmission lines may be connected to corresponding arrayelement controlling components (not shown in the figures); thus arrayelement assembly 20 will connect to a corresponding array elementcontrolling component to cause a signal transmission.

In one embodiment, each group of signal transmission lines used hereinmay comprise any suitable types of components for signal transmission ofan array element of the array element assembly 20. For example, in oneembodiment, each group of signal transmission lines may be a flexibleprinted circuit board (FPC), or other suitable signal transmissioncomponents such as a printed circuit board (PCB), a suitable cable orthe like.

In one embodiment, each group of signal transmission lines and eachcorresponding layer of conductive elements may be connected in anysuitable manner, such as by welding and so on.

In one embodiment, each layer of “wiring connection region” (e.g., thefirst-layer wiring connection region 2100, the second-layer wiringconnection region 2110, the third-layer wiring connection region 2120the fourth-layer wiring connection region 2150 and the fifth-layerwiring connection region 2160) at each layer of the body (e.g., thefifth-layer body 216, the fourth-layer body 215, the third-layer body212, the second-layer body 211 and the first-layer body 210) may referto a region where a conductive element is located for connecting with acorresponding signal transmission line, or to a region for connectingwith a corresponding signal transmission line.

As explained above, each layer of a wiring connection region may be partof the lower surface of each body of the connection component for arrayelements 21 uncovered by another body, or may be the total lower surfaceof the body located at the lowest layer. In one embodiment, the wiringconnection regions which are formed by part of the lower surface of thebody uncovered by another body may have a random shape and/or quantityand may be configured freely and flexibly according to an actual design.For example, in one embodiment as shown in FIG. 10, wiring connectionregions of the bodies except the lowest body 216 in the connectioncomponent for array elements 21 may be ring-shaped or one embodiment maybe bilaterally and/or fore-and-aft symmetrical. It would be understoodthat the connection component for array elements 21 may be asymmetric,and the whole shape thereof may be configured flexibly based on anactual design.

It would be understood that the wiring connection region of the lowestlayer of a body may also be formed by part of the lower surface of thelowest layer of the body instead of the whole lower surface of thelowest layer of the body.

The aforesaid situations herein are uniformly referred to as “forming awiring connection region” on the lower surface of a corresponding body.

In the foregoing embodiments, the connection component for arrayelements 21 of the transducer 2 may have five layers of bodies. However,it may have any quantity of layers, which may be flexibly configuredaccording to an actual design and/or the quantity and/or dimensions ofthe probe, the array element assembly 20, the connection component forarray elements and the signal transmission line, as long as it has atleast two layers of bodies.

It would be understood that the lower surface of the lowest layer of thebody may not be provided with the wiring connection region; instead, thelowest layer of the body may only be used for covering the body adjacentthereto, and the wiring connection region is provided on all or part ofthe bodies except on the lowest layer.

For example, in another embodiment, the ultrasonic probe may include anultrasonic head housing 1, a transducer 2 and a handle module 3. Theultrasonic head housing 1 and the handle module 3 may form a receivingcavity when they connect to each other. The transducer 2 may be fixedlyaccommodated in the receiving cavity. The transducer 2 may include anarray element assembly 20, a connection component for array elements 21and a signal transmission line component 22. It is different fromforegoing embodiments in that the connection component for arrayelements 21 in this embodiment may only have two layers of bodies.

For example, in one embodiment (referring to FIGS. 2-10), the connectioncomponent for array elements 21 may have a first-layer body 210 and asecond-layer body 211. The first-layer body 210 may have a first uppersurface 2101 and a first lower surface 2102; and the second-layer body211 may have a second upper surface 2111 and a second lower surface2112.

The second upper surface 2111 of the second-layer body 211 may contactthe first lower surface 2102 of the first-layer body 210, and an area ofthe second upper surface 2111 of the second-layer body 211 may besmaller than an area of the lower surface 2102 of the first-layer body210. So at least a part of the lower surface 2102 of the first-layerbody 210 may extend beyond the second upper surface 2111 of thesecond-layer body 211, and this region may form a first-layer wiringconnection region 2100 of the first-layer body 210.

In one embodiment, the second lower surface 2112 of the second-layerbody 211 may provide a second-layer wiring connection region 2110 of thesecond-layer body.

The first-layer wiring connection region 2100 may be provided with atleast a first-layer conductive element 2105 which may pass through thefirst-layer body 210 and extend to the first upper surface 2101 of thefirst-layer body 210.

The second-layer wiring connection region 2110 may be provided with atleast a second-layer conductive element 2115 which may pass through thesecond-layer body 211 and the first-layer body 210 and extend to thefirst upper surface 2101 of the first-layer body 210.

The first upper surface 2101 of the first-layer body 210 may be providedwith a plurality of conductive contacts 2106 for electrically connectingto the array element assembly 20. Each conductive contact 2106 may beelectrically connected to one of the array elements in the array elementassembly 20. The configuration of the conductive contacts can beidentical or similar to those in the foregoing embodiments, which willnot be repeated herein.

As previously described, the first-layer conductive element 2105 on thefirst-layer wiring connection region 2100 may pass through thefirst-layer body 210 and extend to the first upper surface 2101 of thefirst-layer body 210. For example, the first-layer conductive elements2105 may pass through the first-layer body 210 via holes formed in thefirst-layer body 210, extend to the first upper surface 2101 of thefirst-layer body 210, and electrically connect to the aforementionedplurality of conductive contacts 2106. Each first-layer conductiveelement 2105 may be connected to one of the conductive contacts 2106.

Similarly, the second-layer conductive elements 2115 on the second-layerwiring connection region 2110 may also pass through the second-layerbody 211 and the first-layer body 210 via holes formed in thesecond-layer body 211 and the first-layer body 210, extend to the firstupper surface 2101 of the first-layer body 210, and electrically connectthe aforementioned plurality of conductive contacts 2106. Eachsecond-layer conductive element 2115 may be connected to one of theconductive contacts 2106.

In one embodiment, the connection component for array elements mayinclude two layers of bodies; for example, the sum of the first-layerconductive elements 2105 and the second-layer conductive elements 2115may be equal to the amount of conductive contacts 2106 on the firstupper surface 2101 of the first-layer body 210. That is, the first-layerconductive elements 2105 and the second-layer conductive elements 2115may correspond one-to-one to conductive contacts 2106 on the first uppersurface 2101 of the first-layer body 210.

In one embodiment, the second-layer body 211 and the first-layer body210 which may be separate components which can be connected together, orthe second-layer body 211 and the first-layer body 210 may be moldedintegrally.

In one embodiment, the signal transmission line component 22 may includea first-group signal transmission line 220 and a second-group signaltransmission line 221.

In one embodiment, the first-group signal transmission line 220 may beconnected to the first-layer conductive element 2105 which is providedon the first-layer wiring connection region 2100 of the elementconnecting component 21; and the second-group signal transmission line221 may be connected to the second-layer conductive element 2115 whichis provided on the second-layer wiring connection region 2110 of theelement connecting component 21. As previously described, conductiveelements in each wiring connection region of the connection componentfor array elements 21 may be respectively connected to each conductivecontact 2106 which is in the first upper surface 2101 of the connectioncomponent for array elements 21, and the conductive contacts 2106 mayalso be respectively connected to each array element in the arrayelement assembly 20. Thus, the electrical connection between each groupof signal transmission lines and each array element of the array elementassembly 20 can be achieved by a connection component for array elements21 in this manner for signal transmission.

Other features in one embodiment can be identical or similar to those inthe foregoing embodiments, which will not be repeated herein.

In still another embodiment, the ultrasonic probe may have an ultrasonichead housing 1, a transducer 2 and a handle module 3. The ultrasonichead housing 1 and the handle module 3 may form a receiving cavity whenthey connect to each other. The transducer 2 may be fixedly accommodatedin the receiving cavity. The transducer 2 may include an array elementassembly 20, a connection component for array elements 21 and a signaltransmission line component 22. It is different from foregoingembodiments in that the connection component for array elements 21 inthis embodiment may only have three layers of bodies.

For example, in one embodiment (still referring to FIGS. 2-10), theconnection component for array elements 21 has a first-layer body 210, asecond-layer body 211 and a third-layer body 212. The first-layer body210 may have a first upper surface 2101 and a first-layer lower surface2102; the second-layer body 211 may have a second upper surface 2111 anda second lower surface 2112; and the third-layer body 212 may include athird upper surface 2121 and a third lower surface 2122.

The second upper surface 2111 of the second-layer body 211 may contactthe lower surface 2102 of the first-layer body 210, and an area of thesecond upper surface 2111 of the second-layer body 211 may be smallerthan an area of the lower surface 2102 of the first-layer body 210. Soat least a part of the lower surface 2102 of the first-layer body 210may extend beyond the second upper surface 2111 of the second-layer body211, and this region may form a first-layer wiring connection region2100 of the first-layer body 210.

Similarly, the third upper surface 2121 of the third-layer body 212 maycontact the third lower surface 2122 of the second-layer body 211, andan area of the third upper surface 2121 of the third-layer body 212 maybe smaller than an area of the third lower surface 2122 of thesecond-layer body 211, so that at least one region of the third lowersurface 2122 of the second-layer body 211 may extend beyond the thirdupper surface 2121 of the third-layer body 212. The region extending outof the third upper surface 2121 in the second lower surface 2112 mayform a second-layer wiring connection region 2110 of the second-layerbody 211.

In one embodiment, the third lower surface 2122 of the third-layer body212 may provide a third-layer wiring connection region 2120 of thethird-layer body.

The first-layer wiring connection region 2100 may be provided with atleast a first-layer conductive element 2105 which may pass through thefirst-layer body 210 and extend to the first upper surface 2101 of thefirst-layer body 210.

The second-layer wiring connection region 2110 may be provided with atleast a second-layer conductive element 2115 which may pass through thesecond-layer body 211 and the first-layer body 210 and extend to thefirst upper surface 2101 of the first-layer body 210.

The third-layer wiring connection region 2120 may be provided with atleast a third-layer conductive element 2125 which may pass through thethird-layer body 212, the second-layer body 211 and the first-layer body210 and extend to the first upper surface 2101 of the first-layer body210.

The first upper surface 2101 of the first-layer body 210 may be providedwith a plurality of conductive contacts 2106 for electrically connectingto the array element assembly 20. Each conductive contact 2106 may beelectrically connected to one of the array elements in the array elementassembly 20. The configuration of the conductive contacts can beidentical or similar to those in the foregoing embodiments, which willnot be repeated herein.

As previously described, the first-layer conductive element 2105 on thefirst-layer wiring connection region 2100 may pass through thefirst-layer body 210 and extend to the first upper surface 2101 of thefirst-layer body 210. For example, the first-layer conductive element2105 may pass through the first-layer body 210 via holes formed in thefirst-layer body 210, extend to the first upper surface 2101 of thefirst-layer body 210, and electrically connect the aforementionedplurality of conductive contacts 2106. Each first-layer conductiveelement 2105 may be connected to one of the conductive contacts 2106.

Similarly, the second-layer conductive element 2115 on the second-layerwiring connection region 2110 may also pass through the second-layerbody 211 and the first-layer body 210 via holes formed in thesecond-layer body 211 and the first-layer body 210, extend to the firstupper surface 2101 of the first-layer body 210, and electrically connectthe aforementioned plurality of conductive contacts 2106. Eachsecond-layer conductive element 2115 may be connected to one of theconductive contacts 2106.

Similarly, the third-layer conductive element 2125 on the third-layerwiring connection region 2120 may also run through the third-layer body212, the second-layer body 211 and the first-layer body 210 via holesformed at the third-layer body 212, the second-layer body 211 and thefirst-layer body 210, extend to the first upper surface 2101 of thefirst-layer body 210, and electrically connect the aforementionedplurality of conductive contacts 2106. Each second-layer conductiveelement 2125 may be connected to one of the conductive contacts 2106.

In one embodiment, the connection component for array elements mayinclude three layers of bodies; for example, the sum of the first-layerconductive elements 2105, the second-layer conductive elements 2115 andthe third-layer conductive elements 2125 may equal the amount ofconductive contacts 2106 on the first upper surface 2101 of thefirst-layer body 210. That is, the first-layer conductive elements 2105,the second-layer conductive elements 2115 and the third-layer conductiveelements 2125 may correspond one-to-one to conductive contacts 2106 onthe first upper surface 2101 of the first-layer body 210.

In one embodiment, the third-layer body 212, the second-layer body 211and the first-layer body 210 may be separate components that can beconnected together, or the third-layer body 212, the second-layer body211 and the first-layer body 210 may be molded integrally.

In one embodiment, the signal transmission line component 22 may includea first-group signal transmission line 220, a second-group signaltransmission line 221 and a third-group signal transmission line 222.

In one embodiment, the first-group signal transmission line 220 may beconnected to the first-layer conductive elements 2105 which are providedin the first-layer wiring connection region 2100 of the elementconnecting component 21; the second-group signal transmission line 221may be connected to the second-layer conductive element 2115 which isprovided in the second-layer wiring connection region 2110 of theelement connecting component 21, and the third-group signal transmissionline 222 may connect to the third-layer conductive element 2125 which isprovided on the third-layer wiring connection region 2120 of the elementconnecting component 21. As previously described, conductive elements ineach wiring connection region of the connection component for arrayelements 21 may be respectively connected to each conductive contact2106 that is in the first upper surface 2101 of the connection componentfor array elements 21. The conductive contacts 2106 may also berespectively connected to each array element in the array elementassembly 20. Thus, the electrical connection between each group ofsignal transmission lines and each array element of the array elementassembly 20 can be achieved by connection component for array elements21 in this manner for signal transmission.

Other features in one embodiment can be identical or similar to those inforegoing embodiments, which will not be repeated herein.

It would be appreciated that the connection component for array elements21 may have more layers of bodies.

In some embodiments of the present disclosure, each layer of the body ofthe connection component for array elements 21 may be made of anysuitable material, such as plastic material. In other embodiments of thepresent disclosure, each layer of the body of the connection componentfor array elements 21 may be made of backing material for an ultrasonicprobe.

In some embodiments, each layer of the body of the connection componentfor array elements 21 may be made of the same material. In otherembodiments, at least one layer of the bodies of the connectioncomponent for array elements 21 may be made of material different fromthat in other layers of the bodies.

For example, another embodiment of the connection component for arrayelements 21 and signal transmission line component 22 in an ultrasonicprobe is shown in FIG. 11 and FIG. 12. In one embodiment, the signaltransmission line component 22 may have a plurality of groups of signaltransmission lines, and each group of signal transmission lines isprovided with a substrate layer and a wire formed on the substratelayer. For example, the first-group signal transmission line 220 mayhave a first-group substrate layer 2200 and a first-group wire 2201formed on the first-group substrate layer 2200; the second-group signaltransmission line 221 may have a second-group substrate layer 2210 and asecond-group wire 2211 formed on the second-group substrate layer 2210.In a similar manner, other groups of signal transmission lines may haverespective substrate layers and respective wires, e.g., the third-groupsignal transmission line may include a third-group substrate layer and athird-group wire may be formed on the third-group substrate layer (notshown in FIG. 11 and FIG. 12), and the fourth-group signal transmissionline may include a fourth-group substrate layer and a fourth-group wireformed on the fourth-group substrate layer (not shown in FIG. 11 andFIG. 12), and so forth.

In one embodiment, the first-layer body 210 may be identical to orsimilar to the first-layer body 210 mentioned in foregoing embodiments.It is different from the foregoing embodiments in that at least onelayer of the body below the first-layer body 210 may be moldedintegrally with a substrate layer of a signal transmission line of itsadjacent and upper layer of body, or one layer of the body below thefirst-layer body 210 may be an extension part of the substrate layer ofthe signal transmission line of its adjacent and upper layer body. Forexample, as shown in FIG. 11 and FIG. 12, the second-layer body 211 maybe molded integrally with the first-group substrate layer 2200 of thefirst-group signal transmission line 220, and the signal transmissionline is connected with the first-layer conductive element 2105 locatedon the first-layer wiring connection region 2100 of the first-layer body210. Alternatively, the second-layer body 211 may be an extension partof the first-group substrate layer 2200. The third-layer body 212 may bemolded integrally with the second-group substrate layer 2210 of thesecond-group signal transmission line 221, and the second-group signaltransmission line 221 is connected with the second-layer conductiveelement 2115 located on the second-layer wiring connection region 2110of the second-layer body 211; alternatively, the third-layer body 212may be extension part of the second-group substrate layer 2210.Similarly, if there are more bodies below the third-layer body 212, eachof them may be formed in a similar manner. For example, the fourth-layerbody may be molded integrally with the third-group substrate layer ofthe third-group signal transmission line, and the third-group signaltransmission line is connected with the third-layer conductive elementlocated on the third-layer wiring connection region of the third-layerbody. Alternatively, the fourth-layer body may be extension of part ofthe third-group substrate layer, and so forth.

It is noted that, in FIG. 11 and FIG. 12, the structure of each bodybelow the third-layer body 212 may be similar to that of thesecond-layer body 211 and the third-layer body 212, but the quantity ofconductive elements passing through each body may gradually decreasefrom upper body to lower body, wherein the quantity of conductiveelements in one layer of body may include those belonging to said bodyitself and those passing through said body but belonging to the otherbody that is below said body. Similarly, the structure of the signaltransmission line connected to the conductive element of each body belowthe third-layer body 212 may be similar to that of the first-groupsignal transmission line 220 and the second-group signal transmissionline 221. Therefore, each body and corresponding signal transmissionline below the third-layer body 212 is not described in detail and isschematically illustrated with a thin solid line in FIG. 11 and FIG. 12instead.

An end of the first-group wire 2201 of the first-group signaltransmission line 220 is provided with a first-group wire contact point2202, and an end of the second-group wire 2211 of the second-groupsignal transmission line 221 is provided with a second-group wirecontact point 2212. The first-group wire 2201 may be connected to thefirst-layer conductive element 2105 of the first-layer body 210 througha first-group wire contact point 2202, which may pass through afirst-group substrate layer 2200. The second-group wire 2211 may beconnected to the second-layer conductive element 2115 of thesecond-layer body 211 through a second-group wire contact point 2212,which may pass through a second-group substrate layer 2210. Similarly,other signal transmission lines (if there are any) may also have asimilar structure and connect in a similar manner. For example, thethird-group wire may be connected to the third-layer conductive elementof the third-layer body through a third-group wire contact point (notshown in FIG. 11 and FIG. 12) and so forth.

In one embodiment as shown in FIG. 11 and FIG. 12, the wire and wirecontact point of each group of signal transmission line may be arrangedbelow the corresponding substrate layer. However, it would be understoodthat, in other embodiments, the wire and wire contact point of eachgroup of signal transmission lines may be arranged above thecorresponding substrate layer; in this option, when the wire isconnected to the corresponding conductive element of the correspondingbody through the corresponding wire contact point, there may be no needto pass through the corresponding substrate layer.

In one embodiment, the ends of conductive elements of each body, such asthe ends of first-layer conductive element 2105 and the second-layerconductive element 2115, etc., for connecting with a correspondingsignal transmission line, may be made in any form suitable forelectrical connection, for example, in the form of pads (shown in FIG. 7or FIG. 12).

Other features in one embodiment can be identical or similar to those inforegoing embodiments, which will not be repeated herein.

In one embodiment, each layer of conductive elements passing bodies,such as the second-layer conductive element 2115, the third-layerconductive element 2125, the fourth-layer conductive element 2155 andthe fifth-layer conductive element 2165 in FIG. 7, or the second-layerconductive element 2115 and the third-layer conductive element 2125, andso on, may have contact points B to facilitate manufacture, which arelocated between passed bodies, if the bodies are separated and thenconnected together in the manner described in above embodiments. Thecontact points B are identical to or similar to the wire contact pointof the signal transmission line, such the first-group wire contact point2202 or the second-group wire contact point 2212 as shown in FIG. 12.Accordingly, in manufacturing, the contact points may first be formed onboth sides of each layer of body and each pair of contact points of onelayer may be connected to each other by a conductive material C passingthrough the corresponding body. Then, the contact points on each bodymay be connected accordingly to when layers of body are connected toeach other. Finally, the contact points B connected between each layerof body and the conductive material C may constitute the conductiveelement of each layer of body mentioned above, when layers of body areconnected to each other. In other words, in one embodiment, the“conductive element” in each layer of body may be constituted by severalparts connected to each other. Alternatively, as previously described,the “conductive element” in each layer of body may an integrally moldedcomponent, such as conductive element 2115, 2125, 2155, 2165, etc.,shown in FIG. 9.

In one embodiment, the layer quantity of bodies in the connectioncomponent for array elements 21 may be flexibly configured according toan actual design, as long as the connection component for array elements21 has at least two layers of bodies, which may be flexibly configuredaccording to an actual design and/or quantity and/or dimension of theprobe, the array element assembly 20, the connection component for arrayelements and the signal transmission line, as long as it has at leasttwo layers of bodies.

In one embodiment, the quantity and arrangement of the conductiveelements in the connection component for array elements 21 of each layerof body may be configured flexibly based on an actual design, which willnot be limited to a particular quantity and arrangement in the presentdisclosure.

In the foregoing embodiments, when referring to a “group” of components,such as the first-group signal transmission line, the second-groupsignal transmission line, the first-group substrate layer, thesecond-group substrate layer, etc., the “group” of components may beonly one component or may contain a plurality of components.

In the foregoing embodiments, the first-group signal transmission line220 may be connected with the first-layer conductive element 2105 of thewiring connection region of each layer of body in any suitable manner.For example, as shown in FIG. 2 or FIG. 11, the extension direction ofthe first-group signal transmission line 220 may be perpendicular tothat of the first-layer conductive element 2105. Alternatively, as shownin FIG. 13, the extension direction of the first-group signaltransmission line 220 may be parallel to or coincide with that of thefirst-layer conductive element 2105.

In still another embodiment, a transducer 2 of the ultrasonic probe mayinclude more than one connection component for array elements 21;instead, it may have a plurality of connection components for arrayelements 21. That is, an array element assembly 20 may be connected tothe more than one connection component for array elements 21. In oneembodiment as shown in FIG. 14 and FIG. 15, the array element assembly20 is connected to two connection components for array elements 21. Inone embodiment, the array element assembly 20 may be connected to atleast one connection component for array elements 21, that is, theultrasonic probe may have at least one connection component for arrayelements.

Herein, when referring to an “above/upper” or “below/lower” position, itmeans the ultrasonic probe is placed vertically and the ultrasonic headis upward.

Accordingly, an ultrasonic imaging system is provided in still anotherembodiment of the present disclosure, which includes a host and any oneof the ultrasonic probes mentioned above. The ultrasonic probe may beconnected to the host which may receive ultrasonic echoes and make theultrasonic probe emit ultrasonic waves, so as to achieve ultrasonicscanning and imaging. In one embodiment, the host may be a conventionalhost employed in a field of ultrasonic imaging.

In one embodiment, the connection component for array elements may be ina stepped shape. The signal transmission line may be connected to anarray element assembly through the stepped connection component, sothere might be sufficient space for interconnection between the arrayelement assembly and the signal transmission line, such as an FPC, PCB,cable, etc.

In one embodiment, since the stepped connection component for arrayelements may be an integral component, there may be a reduction in thealignment requirement and assembly difficulty when it is interconnectedwith array elements in the array element assembly. At the same time,signal transmission lines, such as an FPC, PCB, cable, etc., mayengender a multi-layer structure when they are connected with thestepped connection component for array elements, because the latter hasa multi-layered structure. Thus there might be sufficient space for thesignal transmission lines. Moreover, the quantity of the body of thestepped connection component for array elements might be reasonablyselected in accordance with the quantity of the array elements in thearray element assembly, the processing difficulty of the steppedconnection component for array elements, and the quantity ofcorresponding array element controlling components. As a result, thesignal transmission lines might be arranged easily and flexibly, and theinterference problem and difficulty of wiring arrangement caused bycomplicated and compact wiring might be reduced, and the interconnectionbetween the array element assembly and corresponding array elementcontrolling component via the signal transmission line might be improvedwith less cost.

The foregoing embodiments with detailed descriptions represent severalimplementations of the present disclosure, but they should not beconstrued as limiting the scope of the present disclosure. It should benoted that, for those skilled in the art, a number of modifications andimprovements can also be made without departing from the idea of thepresent disclosure, which is within the claimed scope of the presentdisclosure. Therefore, the claimed scope of the present disclosureshould be subject to the appended claims.

We claim that:
 1. A connection component for array elements in anultrasonic probe, comprising: a first-layer body, which has a firstupper surface and a first lower surface; a second-layer body, which hasa second upper surface and a second lower surface, wherein the secondupper surface is in contact with the first lower surface, an area of thesecond upper surface is smaller than an area of the first lower surface,a region in the first lower surface that extends beyond the second uppersurface forms a first-layer wiring connection region, and the secondlower surface forms a second-layer wiring connection region; afirst-layer conductive element, which is arranged on the first-layerwiring connection region, and extended to the first upper surface of thefirst-layer body by penetrating through the first-layer body; and asecond-layer conductive element, which is arranged on the second-layerwiring connection region, and extended to the first upper surface of thefirst-layer body by penetrating through the second-layer body and thefirst-layer body.
 2. The connection component for array elementsaccording to claim 1, further comprising: a third-layer body, which hasa third upper surface and a third lower surface, wherein the third uppersurface is in contact with the second lower surface, an area of thethird upper surface is smaller than an area of the second lower surface,a region in the second lower surface that extends beyond the third uppersurface forms a second-layer wiring connection region, and the thirdlower surface forms a third-layer wiring connection region; and athird-layer conductive element, which is arranged on the third-layerwiring connection region, and extended to the first upper surface of thefirst-layer body by penetrating through the third-layer body, thesecond-layer body and the first-layer body.
 3. An ultrasonic probe,comprising a transducer, wherein the transducer comprises: an arrayelement assembly, which comprises a plurality of array elements; aconnection component for array elements, which comprises: a first-layerbody, wherein the first-layer body has a first upper surface and a firstlower surface, a plurality of conductive contacts are arranged on thefirst upper surface, and each conductive contact is connected to one ofthe array elements respectively; a second-layer body, which has a secondupper surface and a second lower surface, wherein the second uppersurface is in contact with the first lower surface, an area of thesecond upper surface is smaller than an area of the first lower surface,a region in the first lower surface that extends beyond the second uppersurface forms a first-layer wiring connection region, and a second lowersurface forms a second-layer wiring connection region; a plurality offirst-layer conductive elements, which are arranged on the first-layerwiring connection region, and extended to the first upper surface of thefirst-layer body by penetrating through the first-layer body, whereineach first-layer conductive element is connected to one of theconductive contacts; and a plurality of second-layer conductiveelements, which are arranged on the second-layer wiring connectionregion, and extended to the first upper surface of the first-layer bodyby penetrating through the second-layer body and the first-layer body,wherein each second-layer conductive element is connected to one of theconductive contacts; a first-group signal transmission line, which isconnected to the plurality of first-layer conductive elements; and asecond-group signal transmission line, which is connected to theplurality of second-layer conductive elements.
 4. The ultrasonic probeaccording to claim 3, wherein: the first-group signal transmission lineis provided with a first-group substrate layer and a first-group wireformed on the first-group substrate layer; the second-group signaltransmission line is provided with a second-group substrate layer and asecond-group wire formed on the second-group substrate layer; thesecond-layer body is an extension part of the first-group substratelayer; the first-group wire is connected to the first-layer conductiveelement; the second-group wire is connected to the second-layerconductive element.
 5. The ultrasonic probe according to claim 3,wherein: the connection component for array elements further comprises:a third-layer body, which has a third upper surface and a third lowersurface, wherein the third upper surface is in contact with the secondlower surface, an area of the third upper surface is smaller than anarea of the second lower surface, a region in the second lower surfacethat extends beyond the third upper surface forms a second-layer wiringconnection region, and the third lower surface forms a third-layerwiring connection region; and a plurality of third-layer conductiveelements, which are arranged on the third-layer wiring connectionregion, and extended to the first upper surface of the first-layer bodyby penetrating through the third-layer body, the second-layer body andthe first-layer body, wherein each third-layer conductive element isconnected to one of the conductive contacts; the ultrasonic transducerfurther comprises a third-group signal transmission line connected tothe a plurality of third-layer conductive elements.
 6. The ultrasonicprobe according to claim 5, wherein: the first-group signal transmissionline is provided with a first-group substrate layer and a first-groupwire formed on the first-group substrate layer; the second-group signaltransmission line is provided with a second-group substrate layer and asecond-group wire formed on the second-group substrate layer; thethird-group signal transmission line is provided with a third-groupsubstrate layer and a third-group wire formed on the third-groupsubstrate layer; the second-layer body is an extension part of thefirst-group substrate layer; the third-layer body is an extension partof the second-group substrate layer; the first-group wire is connectedto the first-layer conductive element; the second-group wire isconnected to the second-layer conductive element; the third-group wireis connected to the third-layer conductive element.
 7. The ultrasonicprobe according to claim 3, wherein the first upper surface is providedwith a plurality of conductive contacts and each conductive contract iselectrically connected to one of the array elements.
 8. The ultrasonicprobe according to claim 3, wherein each array element comprises atransducer element and a backing block connected with the transducerelement.
 9. The ultrasonic probe according to claim 8, wherein thefirst-layer body, the second-layer body and the backing block are madeof the same material.
 10. An ultrasonic imaging system, which comprisesthe ultrasonic probe of claim 3.